EXP-355: Solderless Breadboard, 470 Tie-Points


The Global Specialties EXP-355 has 470 tie-points and offers unlimited circuit design expansion though its unique molded-in interlocking edge rails. It offers 0.3" DIP spacing, and its unique molded-in mounting holes allow for either front or rear mounting. Molded interlocking edge rails on all four sides permit parallel or perpendicular socket arrays, allowing more boards to be added at any point for maximum circuit design flexibility. The integrated bus strips allow for fast connections to power and signal lines. The EXP-355 is made from high impact plastic with phosphor bronze contacts. It has a heavy-duty Mylar backing to prevent short circuits.

MSRP: $7.20

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EXP-355: Solderless Breadboard, 470 Tie-Points Specifications

Solderless Breadboard
Breadboard Material
Spring Clip Material
Nickel plated phosphor bronze
Allowable Wire Diameter
0.4 - 0.7 mm
4.12 in
2.31 in
8 mm (0.33 in)
Current Capacity
1.5 A, 36 V
16-Pin IC Capacity
3 year

EXP-355: Solderless Breadboard, 470 Tie-Points Downloads

EXP-355 Solderless Breadboard, 470 Tie-Points Documents


Where to Buy the EXP-355: Solderless Breadboard, 470 Tie-Points

DistributorQuantityLast Updated
Mouser Electronics 3July 22nd, 2019
Tequipment.Net 40July 22nd, 2019
Digi-Key Corporation 39July 22nd, 2019

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