GS-300: Solderless Breadboard, 300 Tie-Points

 

The Global Specialties GS-300 has 300 tie-points and offers unlimited circuit design expansion though its unique molded-in interlocking edge rails and standard 0.3" DIP spacing. Molded interlocking edge rails on all four sides permit parallel or perpendicular socket arrays, allowing more boards to be added at any point for maximum circuit design flexibility. The GS-300 is made from high impact plastic with phosphor bronze contacts. It has a heavy-duty Mylar backing to prevent short circuits.

MSRP: $3.50

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GS-300: Solderless Breadboard, 300 Tie-Points Specifications

Type
Solderless Breadboard
 
Tie-Points
300
 
Breadboard Material
ABS
 
Spring Clip Material
Nickel plated phosphor bronze
 
Allowable Wire Diameter
0.4 - 0.7 mm
 
Length
3.39 in
 
Width
1.46 in
 
Depth
0.33 in
 
Assembly
NA
 
Current Capacity
1.5 A, 36 V
 
16-Pin IC Capacity
3
 
Warranty
3 year
 

GS-300: Solderless Breadboard, 300 Tie-Points Downloads

GS-300 Solderless Breadboard, 300 Tie-Points Documents

 
 

Where to Buy the GS-300: Solderless Breadboard, 300 Tie-Points

DistributorQuantityLast Updated
Mouser Electronics 15December 16th, 2018
Tequipment.Net 40December 16th, 2018
Newark Electronics 32December 16th, 2018
 

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