EXP-355: Solderless Breadboard, 470 Tie-Points

 

The Global Specialties EXP-355 has 470 tie-points and offers unlimited circuit design expansion though its unique molded-in interlocking edge rails. It offers 0.3" DIP spacing, and its unique molded-in mounting holes allow for either front or rear mounting. Molded interlocking edge rails on all four sides permit parallel or perpendicular socket arrays, allowing more boards to be added at any point for maximum circuit design flexibility. The integrated bus strips allow for fast connections to power and signal lines. The EXP-355 is made from high impact plastic with phosphor bronze contacts. It has a heavy-duty Mylar backing to prevent short circuits.

MSRP: $7.20

Global Specialties EXP-355 Solderless Breadboard, 470 Tie-Points

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EXP-355: Solderless Breadboard, 470 Tie-Points Specifications

Type
Solderless Breadboard
 
Tie-Points
470
 
Terminal Clips
94
 
Breadboard Material
ABS
 
Spring Clip Material
Nickel plated phosphor bronze
 
Allowable Wire Diameter
0.4 - 0.7 mm
 
Length
4.12 in
 
Width
2.31 in
 
Depth
8 mm (0.33 in)
 
Assembly
NA
 
Current Capacity
1.5 A, 36 V
 
16-Pin IC Capacity
5
 
Warranty
1 year
 

EXP-355: Solderless Breadboard, 470 Tie-Points Downloads

EXP-355 Solderless Breadboard, 470 Tie-Points Documents

 
 

Where to Buy the EXP-355: Solderless Breadboard, 470 Tie-Points

DistributorQuantityLast Updated
Tequipment.Net 1May 23rd, 2017
Digi-Key Corporation 120May 23rd, 2017

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