EXP-350E: Solderless Breadboard, 270 Tie-Points

 

The EXP-350E offers molded interlocking edge rails on all four sides to permit parallel or perpendicular socket arrays, allowing more boards to be added at any point for maximum circuit design flexibility. The EXP-350E utilizes 0.3" DIP spacing and the molded-in mounting holes allow for either front or rear mounting.  There is a heavy-duty Mylar backing to prevent short circuits. The integrated bus strips allow for fast connections to power and signal lines. Made from high impact plastic with phosphor bronze contacts, the EXP-350E is built for quality and performance.

MSRP: $5.15

Global Specialties EXP-350E Solderless Breadboard, 270 Tie-Points

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EXP-350E: Solderless Breadboard, 270 Tie-Points Specifications

Type
Solderless Breadboard
 
Tie-Points
270
 
Terminal Clips
54
 
Breadboard Material
ABS
 
Spring Clip Material
Nickel plated phosphor bronze
 
Allowable Wire Diameter
0.4 - 0.7 mm
 
Length
3.25 in
 
Width
1.75 in
 
Depth
8 mm (0.33 in)
 
Assembly
NA
 
Current Capacity
1.5 A, 36 V
 
16-Pin IC Capacity
3
 
Warranty
1 year
 

EXP-350E: Solderless Breadboard, 270 Tie-Points Downloads

EXP-350E Solderless Breadboard, 270 Tie-Points Documents

 
 

Where to Buy the EXP-350E: Solderless Breadboard, 270 Tie-Points

DistributorQuantityLast Updated
Tequipment.Net 1May 23rd, 2017
Digi-Key Corporation 582May 23rd, 2017
Mouser Electronics 192May 22nd, 2017

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